Adhesives for Electronics
ZTACH® ACE (Z-Axis Antisotopic Conductive Epoxy)
Comprising of vertically aligned ferromagnetic particles. An alternative to solder, epoxy, ACA, ACF and wire bonding.
ZTACH® ACE is applied with syringe dispense or open aperture stainless steel stencil without any pressure, and once applied to the patented ZMAG® Magnetic Pallet, it can be used with heat at low temperature (80˚C to 160˚C) or with UV energy. This results in the self-assembly of conductive Z-Axis columns at regular intervals throughout the adhesive matrix. The columns create electrical and thermal interconnection in the Z-Axis, while maintaining electrical insulation in the X-Y plane. After formation, the columns maintain their structure due to immobilization within a now rigid polymer matrix.
ZTACH® ACE addresses current interconnect technology manufacturing limitations for fine pitch applications that include sensitivity to pressure and/or high temperatures. Manufacturing processing benefits of ZTACH® ACE also include the elimination of solder bumping, underfill and co-planarity issues. Performance benefits include reduced Silver Migration, increased Thermal Dissipation and high Thermal Post Cure Stability. These features together with bonding reliability & package strength enables ZTACH® ACE to address application challenges such as hybridized electronics, smaller form factors, 3-D Stacking and printed electronics.