Printed Circuit Boards

Printed Circuit Board Fabrication

Quickturn Delivery

• Rigid PCB, Flex Circuits, Rigid Flex
• Fast Delivery of Complex Multilayer and HDI
• Prototype and NPI
• Seamless Migration to Asia for Production Volume

Production Volume

• Rigid, Flex, Rigid Flex
• High Reliability Complex Multilayer and HDI
• Global Facilities - North America and Asia

PCB Fabrication Capabilities – Rigid PCB

Conventional PCBs

Conventional PCBs can be any layer count, but rely on conventional drilling and plating technology.

• Multilayer up to 60+ layers
• Wide range of laminate options including high temperature, low loss and lead-free laminates
• Mixed dielectric (hybrid) constructions
• Panel size up to 30"x 55"
• Embedded coin, or metal core and metal backed MLB
• Panel thickness up to .450"
• RF and microwave circuits
• Heavy copper (10 oz. outer layer / 5 oz. inner layer)
• Embedded, distributed and discrete passive components

High Density Interconnect PCBs

Microvias can be via-in-pad, offset, staggered or stacked, non-conductive filled and copper plated over the top or solid copper filled or plated.

• Microvias
• Stacked Microvias
• Deep Microvia
• Deep Stacked Microvia
• Any Layer HDI

Multilayer copper filled stacked micro via structure 1.2/1.2 mil line/space 4/8 mil laser via capture pad size Material options:

• High temperature FR4
• Halogen - Free
• High Speed (low loss)

Flex and Rigid Flex - PCB Site Certifications

• Type 1: Single sided flexible material with or without shield(s) or stiffener (one conductive layer).
• Type 2: Double sided flexible material with or without shield(s) or stiffener (two conductor layers) with plated through holes.
• Type 3: Multilayer flexible material with or without shield(s) or stiffener (more than two conductor layers) with plated through holes and HDI.
• Type 4: Multilayer rigid and flexible material combinations (more than two conductor layers) with plated through holes and HDI.

ISO 9001, ISO13485, ISO14001, AS9100C, TS16949, MIL-PRF-31032, MIL-PRF-55110(G), ITAR, NADCAP, UL796,Bellcore Compliant, TL9000